Solder interconnection structure and process for making

Details Solder interconnection structure and process for making Solder interconnection structure and process for making

1990-03-14

1991-03-12

Hille, Rolf

Stock material or miscellaneous articles

Composite

Of bituminous or tarry residue

357 67, 357 80, 4284228, 4284111, 525107, 525122, 528422, 528210, 528211, H01L 2348, H01L 2940, H01L 2964, H01L 3902

Patent

active

049996991

ABSTRACT:
Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

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