Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1993-11-04
1995-11-28
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
25218311, 257788, 257789, H01L 2329
Patent
active
054710960
ABSTRACT:
Compositions containing bisphenol M dicyanate, prepolymer thereof, or mixtures thereof, and 4,4'-ethylidene bisphenol dicyanate, prepolymer thereof or mixtures thereof; and filler having maximum particle size of 20 microns and being substantially free of alpha particle emissions. The compositions are useful in forming interconnection structures for forming an integrated semiconductor device to a carrier substrate.
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Christie Frederick R.
Papathomas Kostas I.
Wang David W.
Brown Peter Toby
International Business Machines - Corporation
Mintel William
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