Solder hierarchy for chip attachment to substrates

Details Solder hierarchy for chip attachment to substrates Solder hierarchy for chip attachment to substrates

1997-01-16

1998-03-17

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 29840, 257738, 257772, 257778, 361773, 361767, 361803, H05K 702, H05K 111, H01L 2348

Patent

active

057294402

ABSTRACT:
The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.

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