Solder flow stops for semiconductor die substrates

Details Solder flow stops for semiconductor die substrates Solder flow stops for semiconductor die substrates

2005-04-21

2009-11-10

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S779000, C257S731000, C257SE23020

Reexamination Certificate

active

07615873

ABSTRACT:
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.

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