Solder disc connection

Details Solder disc connection Solder disc connection

1997-07-09

2000-06-06

Young, Lee

Metal working

Method of mechanical manufacture

Electrical device making

29840, 2281246, H05K 334

Patent

active

060703210

ABSTRACT:
A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

REFERENCES:
patent: 3089062 (1963-05-01), Schulz
patent: 3331912 (1967-07-01), Stricker
patent: 3392442 (1968-07-01), Napier
patent: 4020987 (1977-05-01), Hascoe
patent: 4640438 (1987-02-01), Trevison et al.
patent: 4746583 (1988-05-01), Falanga
patent: 5153709 (1992-10-01), Fukuoka
patent: 5268815 (1993-12-01), Cipolla et al.
patent: 5294830 (1994-03-01), Young et al.
patent: 5329160 (1994-07-01), Miura et al.
patent: 5372295 (1994-12-01), Abe et al.
patent: 5414300 (1995-05-01), Tozawa et al.
patent: 5471027 (1995-11-01), Call et al.
patent: 5517753 (1996-05-01), Messina
patent: 5523260 (1996-06-01), Missele
patent: 5881945 (1999-03-01), Edwards et al.

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