Solder deposition on wafer backside for thin-die thermal...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support

Reexamination Certificate

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C257S625000, C257SE23101

Reexamination Certificate

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11116554

ABSTRACT:
A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-deposited die is bonded with a heat spreader that did not require a pre-deposited solder.

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patent: 6987671 (2006-01-01), Houle
patent: 7075180 (2006-07-01), Narendra et al.
patent: 2004/0188814 (2004-09-01), Houle et al.
patent: 2004/0227229 (2004-11-01), Hu et al.
Stefan Weib et al., “Design, Simulation and Technological Realization of a Reliable Packaging Concept for High Power Laser Bars” IEEE, Electronic Components and Technology Conference, 1998, pp. 1395-1401.

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