Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-10-30
2007-10-30
Coleman, David W. (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257S625000, C257SE23101
Reexamination Certificate
active
11116554
ABSTRACT:
A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-deposited die is bonded with a heat spreader that did not require a pre-deposited solder.
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Stefan Weib et al., “Design, Simulation and Technological Realization of a Reliable Packaging Concept for High Power Laser Bars” IEEE, Electronic Components and Technology Conference, 1998, pp. 1395-1401.
Coleman David W.
Schwegman Lundberg & Woessner, P.A.
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