Solder deposition control

Details Solder deposition control Solder deposition control

1986-09-15

1990-04-24

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 97, 118213, 118254, 118263, 118264, 118266, B05D 512

Patent

active

049199706

ABSTRACT:
A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the holes is simultaneously, independently controlled as a function of mask thickness, blade hardness and blade to mask angle.

REFERENCES:
patent: 3226255 (1965-12-01), Cieniewicz
patent: 3735730 (1973-05-01), Mitter
patent: 4020206 (1977-04-01), Beil
patent: 4023487 (1977-05-01), Mitter
patent: 4024629 (1977-05-01), Lemoine
patent: 4127337 (1978-11-01), Bishop
patent: 4323593 (1982-04-01), Tsunashima
patent: 4459320 (1984-07-01), Fefferman
patent: 4515304 (1985-05-01), Berger
patent: 4529477 (1985-07-01), Lundberg
patent: 4604966 (1986-08-01), Kohn
patent: 4761881 (1988-08-01), Bora et al.
Simo Karttunen and Pirkko Oittinen, "The Basic Principles of Printing as a Surface Coating Process" in Science and Technology of Surface Coating, ed. B. N. Chapman and J. C. Anderson, Academic Press, 1974, pp. 222-237.

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