Solder bump structure and method for forming the same

Details Solder bump structure and method for forming the same Solder bump structure and method for forming the same

2007-07-31

2007-07-31

Luu, Chuong A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S637000, C438S613000

Reexamination Certificate

active

10936569

ABSTRACT:
A method for forming a solder bump structure with increased height. A substrate having at least one metal bonding pad thereon is provided. A passivation layer is formed on the substrate, which substantially exposes the metal bonding pad. An under ball metallurgy (UBM) layer is formed on the exposed metal bonding pad. A dielectric layer and a resist layer are successively formed on the passivation layer, wherein the dielectric layer has a first opening to expose the UBM layer and the resist layer a second opening over the first opening. A solder bump is formed on the UBM layer in the first and second openings, and the resist layer is then removed.

REFERENCES:
patent: 6278184 (2001-08-01), Jackson et al.
patent: 6299220 (2001-10-01), Bacher et al.
patent: 6372622 (2002-04-01), Tan et al.
patent: 6392163 (2002-05-01), Magill et al.
patent: 6578755 (2003-06-01), Elenius et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6630736 (2003-10-01), Ignaut et al.
patent: 6664128 (2003-12-01), Su et al.
patent: 6707137 (2004-03-01), Kim
patent: 6707153 (2004-03-01), Hanaoka et al.
patent: 6849534 (2005-02-01), Ho et al.
patent: 6878633 (2005-04-01), Raskin et al.

Affiliated with

Also associated with

Rating

Solder bump structure and method for forming the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder bump structure and method for forming the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bump structure and method for forming the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3750219