Solder bump structure and laser repair process for memory...

Details Solder bump structure and laser repair process for memory... Solder bump structure and laser repair process for memory...

2005-04-19

2005-04-19

Lebentritt, Michael (Department: 2824)

Semiconductor device manufacturing: process

Formation of semiconductive active region on any substrate

Fluid growth from liquid combined with preceding diverse...

C438S478000, C438S612000, C438S614000

Reexamination Certificate

active

06881654

ABSTRACT:
A solder bump structure and laser repair process for memory device include forming a first dielectric layer on a bump pad of a semiconductor wafer. After that, the first dielectric layer is etched to form a contact hole and to expose portions of the bump pad. A second dielectric layer is then formed on a surface of the semiconductor wafer outside of the contact hole. An under bump metallurgy (UBM) process is performed to form a metal layer on a surface of the contact hole, and a solder bump is formed on the metal layer. Finally, the laser repair process for memory device is completed.

REFERENCES:
patent: 5977632 (1999-11-01), Beddingfield
patent: 6118180 (2000-09-01), Loo et al.
patent: 6162652 (2000-12-01), Dass et al.
patent: 6395622 (2002-05-01), Liu et al.
patent: 6452270 (2002-09-01), Huang
patent: 6479376 (2002-11-01), Huang et al.
patent: 6528417 (2003-03-01), Wang et al.
patent: 6593220 (2003-07-01), Yu et al.
patent: 6636313 (2003-10-01), Chen et al.

Affiliated with

Also associated with

Rating

Solder bump structure and laser repair process for memory... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder bump structure and laser repair process for memory..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bump structure and laser repair process for memory... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3426852