Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-02-06
2008-11-11
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257S738000, C257S780000, C257S781000, C257SE23020, C257SE23021
Reexamination Certificate
active
07449785
ABSTRACT:
A solder bump on a semiconductor substrate is provided. The solder bump comprises a semiconductor substrate having a top copper pad thereon, a protective layer on the semiconductor substrate and at least one inorganic passivation layer overlying the protective layer with a first opening exposing the top copper pad, wherein the inorganic passivation layer has a thinner portion adjacent a top portion of the first opening. The solder bump further comprises a soft passivation layer on the inorganic passivation layer with a second opening larger than the first opening, an under bump metal layer conformally formed along the first opening and the second opening and a solder bump formed on the under bump metal layer.
REFERENCES:
patent: 6468898 (2002-10-01), Usami
patent: 6617674 (2003-09-01), Becker et al.
patent: 7015133 (2006-03-01), Su et al.
patent: 7033929 (2006-04-01), Burke et al.
patent: 7119439 (2006-10-01), Watanabe et al.
patent: 7224063 (2007-05-01), Agarwala et al.
patent: 7241676 (2007-07-01), Watanabe et al.
patent: 7247555 (2007-07-01), Cong et al.
patent: 7326645 (2008-02-01), Shim
patent: 2002/0043723 (2002-04-01), Shimizu et al.
patent: 2004/0182915 (2004-09-01), Bachman et al.
patent: 2005/0082685 (2005-04-01), Bojkov et al.
Chen Hsien-Wei
Hou Shang-Yun
Jeng Shin-Puu
Tsai Chia-Lun
Tsai Hao-Yi
Muncy Geissler Olds & Lowe, PLLC
Taiwan Semiconductor Manufacturing Co. Ltd.
Zarneke David A
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