Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-10
2006-10-10
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07119002
ABSTRACT:
It is an object of the present invention to provide a method for solder bump formation using a combination of eutectic and high lead solders. The present invention provides a method for improving a solder bump composition for a flip chip.
REFERENCES:
patent: 4908696 (1990-03-01), Ishihara et al.
patent: 6541366 (2003-04-01), Chin et al.
patent: 6740577 (2004-05-01), Jin et al.
patent: 6818545 (2004-11-01), Lee et al.
Duane Morris LLP
Lebentritt Michael
Stevenson Andre′
Taiwan Semiconductor Manufacturing Co. Ltd.
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