Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces
Reexamination Certificate
2000-01-11
2001-05-01
Ryan, Patrick J. (Department: 1725)
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Plural discrete workpieces
C228S006100, C228S049500, C228S119000
Reexamination Certificate
active
06223968
ABSTRACT:
1. FIELD OF THE INVENTION
The present invention, generally, relates to a method and apparatus for soldering small components automatically and, more particularly, to a new and improved component handling technique.
Prior U.S. Pat. No. 4,937,006 to Bickford et al. and assigned to the same Assignee as the present invention relates to a structure and method with which this invention is functional. Therefore, the description therein is incorporated by reference into the present description.
BACKGROUND OF THE INVENTION
Equipment and apparatus for handling microelectronic components during assembly, disassembly and rework phases must have an arrangement whereby the extremely small components are grasped for transporting and positioning accurately. In the past, such an arrangement has included a small nozzle-like structure with its larger end formed to fit the equipment or apparatus with which it is being used and its smaller end formed to receive the component to be handled.
In the microelectronic industry, there are dozens of these extremely small components varying in size from several millimeters down to a fraction of one millimeter, each requiring equipment with special tools in order to pick up, transport and position each component. The equipment to move and otherwise handle these extremely small components has been standardized with all adjustments needed to operate.
However, to avoid the necessity of making adjustments to this apparatus every time a different component is to be placed, it has become the standard practice to size the nozzle-like structure end to receive the component within the end surface, so that the apparatus can be adjusted to position the end surface accurately relative to that end. A component of a different size must have its own nozzle-like structure sized to receive it within that end, so it will not project out requiring another adjustment in order to place it accurately.
This practice has worked well for many years, but with the recent increase in technological advances, usage of this equipment has increased also, because of the increased need for building the circuits using smaller and smaller components. Requiring different component-receiving ends for each different component has become almost a nightmare, because of the need to correlate these ends and the components in a practical manner.
2. REVIEW OF THE PRIOR ART
U.S. Pat. No. 4,767,047 to Todd et al. describes a device for grasping a component by suction and heating the solder that holds it in place to soften the solder, whereby the component is removed from a substrate.
U.S. Pat. No. 4,844,325 to Nishiguchi et al. describes apparatus with a collet to grasp a semiconductor chip by the use of a vacuum pump and blowing an inert gas to heat the entire assembly.
U.S. Pat. No. 5,222,655 to Moretti et al. describes apparatus with an open-channeled member for holding an element by a vacuum and a heated gas system to heat the element for soldering.
It is well recognized that soldering involves the application of heat in order to melt the solder so that it adheres to surfaces for creating both electrical and physical connections. It is recognized also in the microelectronics industry particularly that all such applications of heat must be controlled to avoid damage.
OBJECTS AND SUMMARY OF THE INVENTION
It is a principal object of the present invention to provide a method and a device to permit an object to be grasped and retained for moving and positioning accurately in a cost effective manner.
Another object of the present invention is to provide a method and apparatus that avoids previous problems of having to correlate electrical objects with object-handling equipment.
Briefly, the present invention involves forming a nozzle that has a larger end and a smaller end, the larger end being to fit standard, object-handling equipment. The size and configuration of the smaller end is determined to receive a larger object. Forming an insert to be received within the smaller end opening of the nozzle. Forming the insert with an opening to receive a selected object to be handled. By changing inserts, objects of different sizes and configurations are handled readily.
These and other objects, features and advantages of the present invention will become more readily apparent from the following detailed description of the preferred embodiment.
REFERENCES:
patent: 4564135 (1986-01-01), Baressi et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 4844325 (1989-07-01), Nishiguchi et al.
patent: 4937006 (1990-06-01), Bickford et al.
patent: 5065932 (1991-11-01), Hayden et al.
patent: 5139193 (1992-08-01), Todd
patent: 5419481 (1995-05-01), Lasto et al.
patent: 5579979 (1996-12-01), Kurpiela
patent: 6082608 (2000-07-01), Gabriel et al.
Gabriel Charles Felix
Jimarez Miguel Angel
Zdimal Joseph Edward
Edmondson L.
International Business Machines - Corporation
Pivnichny John R.
Ryan Patrick J.
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