Solder bonding/debonding nozzle insert

Details Solder bonding/debonding nozzle insert Solder bonding/debonding nozzle insert

1998-07-06

2000-07-04

Ryan, Patrick

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

228 62, 228119, 228 471, 29739, 29743, B23K 100, B23K 500, B23K 3102

Patent

active

060826088

ABSTRACT:
In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.

REFERENCES:
patent: 4589586 (1986-05-01), Polansky
patent: 4767047 (1988-08-01), Todd et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 5222655 (1993-06-01), Moretti et al.
patent: 5516030 (1996-05-01), Denton
patent: 5579979 (1996-12-01), Kurpiela

Affiliated with

Also associated with

Rating

Solder bonding/debonding nozzle insert does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder bonding/debonding nozzle insert, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder bonding/debonding nozzle insert will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1478562