Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate
2011-01-11
2011-01-11
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
C228S045000, C029S747000
Reexamination Certificate
active
07866529
ABSTRACT:
A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.
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Kawamura Yoichiro
Kimura Osamu
Mabuchi Yoshiyuki
Sawa Shigeki
Sumita Atsunori
Ibiden Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Stoner Kiley
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