Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-10-17
1999-09-28
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257737, 257706, H01L 2348, H01L 2352, H01L 2940
Patent
active
059593563
ABSTRACT:
A solder ball grid array carrier package has a circuit board with conductive wirings and a plurality of through holes. At least one semiconductor chip is mounted on an upper surface of the circuit board and bonding wires electrically connect the chip to the conductive wirings. A plurality of solder balls are electrically connected to the conductive wirings, with the solder balls being adhered to a lower surface of the circuit board. A heat sink is also adhered to the lower surface of the circuit board. The heat sink is in direct contact with the through holes of the circuit board, with the through holes allowing for heat dissipation.
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Cao Phat X.
Chaudhuri Olik
Samsung Electronics Co,. Ltd.
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