Metal fusion bonding – Process – With measuring – testing – indicating – inspecting – or...
Reexamination Certificate
2005-12-13
2005-12-13
Johnathan, Johnson (Department: 1725)
Metal fusion bonding
Process
With measuring, testing, indicating, inspecting, or...
C228S245000, C228S205000, C228S223000
Reexamination Certificate
active
06974069
ABSTRACT:
The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
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Kang Ju-il
Yang Hee-Sang
Harness & Dickey & Pierce P.L.C.
Johnathan Johnson
Samsung Electronics Co,. Ltd.
Tran Len
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