Metal fusion bonding – Process – Plural joints
Patent
1995-08-24
1997-10-07
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228254, 228 563, 164113, H05K 334, B23K 3514
Patent
active
056738463
ABSTRACT:
A solder decal is produced by a method wherein a decal strip having a plurality of anchor holes is aligned with a mold having a plurality of cells. Liquid solder is injected into the anchor holes and mold cells, and is then allowed to cool to solidify therein. The mold may be separated from the decal strip to form the solder decal containing solder beads each having a stem mechanically joined to the strip at respective ones of the anchor holes. Various forms of the solder decal are used for transferring the solder beads to a substrate or chip, or effecting temporary connections for conducting burn-in and testing, or accommodating thermal mismatch for example.
REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3472365 (1969-10-01), Tiedema
patent: 3517434 (1970-06-01), Shaver
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 3861135 (1975-01-01), Seeger, Jr. et al.
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4050756 (1977-09-01), Moore
patent: 4276923 (1981-07-01), Mislan
patent: 4412642 (1983-11-01), Fisher, Jr.
patent: 4712721 (1987-12-01), Noel et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5388327 (1995-02-01), Trabucco
patent: 5447264 (1995-09-01), Koopman et al.
patent: 5497938 (1996-03-01), McMahon et al.
IBM Technical Disclosure Bulletin, "Bump Tape Connector", vol. 36, No. 09B, pp. 553,554. Sep. 1993.
IBM Technical Disclosure Bulletin, "Peeling Tape Connector", vol. 37, No. 04B, pp. 117-119. Apr. 1994.
IBM Technical Disclosure Bulletin, "Solder Decal Design for Induction Heating Reflow", vol. 37, No. 08, pp. 507,508. Aug. 1994.
IBM Technical Disclosure Bulletin, "Fabrication of Electroplated Stainless Steel Based Eutectic Sn/Pb Solder Decals", vol. 37, No. 12, pp. 231,232. Dec. 1994.
Conte Francis L.
Heinrich Samuel M.
International Business Machines - Corporation
Strunck Stephen S.
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