Solder alloy

Details Solder alloy Solder alloy

1997-10-30

2000-03-07

Wyszomierski, George

Metal treatment

Compositions

Fluxing

420559, B23K 3524, C22C 1300

Patent

active

060334886

ABSTRACT:
A solder alloy includes tin (Sn) of 50-80 wt %, antimony (Sb) of 0.05-10 wt %, silver (Ag) of 0.0001-5 wt %, phosphorus (P) of 0.0001-0.5 wt %, unavoidable impurities, and lead for the remaining wt %. Numerical limitation to the content amount of the respective elements and the rest effects the solder alloy to have an improved fatigue-proof characteristic for a soldering area.

REFERENCES:
patent: 5019336 (1991-05-01), Liebermann et al.
patent: 5229070 (1993-07-01), Melton et al.
patent: 5435857 (1995-07-01), Han et al.
patent: 5851482 (1998-12-01), Kim

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