Solder

Details Solder Solder

2005-03-29

2005-03-29

Zimmerman, John J. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite powder

C428S646000, C428S647000, C428S648000, C428S672000, C428S675000, C228S056300

Reexamination Certificate

active

06872465

ABSTRACT:
In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

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