Solar cell manufacture

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

29572, 29580, 136 89CC, 148178, 148185, 148186, 156648, 156656, 156657, 156661, 156662, H01L 2122, H01L 2124, H01L 21263, H01L 21308

Patent

active

041585917

ABSTRACT:
A method for manufacturing solar cells wherein a plurality of wafers of a first conductivity type are assembled and thereafter doped with an active impurity of an opposite conductivity imparting type to establish a p-n junction. Thereafter front and back contacts are formed on the wafers by metallization, the back contact material being chosen so that it penetrates any p-n junctions present in the area of the back contact, if any, and thereby forms a low resistance ohmic contact through any such junction. Thereafter the contact containing wafers are coin stacked and plasma etched so that the edge faces of the coin stacked wafers have removed therefrom sufficient p-n junction to electrically isolate the front junction from the back junction or junctions.

REFERENCES:
patent: 3460240 (1969-08-01), Tarneja et al.
patent: 3589946 (1971-06-01), Tarneja et al.
patent: 3753809 (1973-08-01), Gaier et al.
patent: 3758348 (1973-09-01), Whigham et al.
patent: 3795557 (1974-03-01), Jacob
patent: 3948682 (1976-04-01), Bordina et al.
patent: 3966577 (1976-06-01), Hochberg
Bassous, "Fabrication . . . Dimensions" IBM Technical Disclosure Bulletin vol. 20, No. 6, (Nov. 1977), pp. 2474-2479.

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