Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region
Reexamination Certificate
2011-01-04
2011-01-04
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Introduction of conductivity modifying dopant into...
Ion implantation of dopant into semiconductor region
C438S276000, C438S289000
Reexamination Certificate
active
07863171
ABSTRACT:
By introducing a atomic species, such as carbon, fluorine and the like, into the drain and source regions, as well as in the body region, the junction leakage of SOI transistors may be significantly increased, thereby providing an enhanced leakage path for accumulated minority charge carriers. Consequently, fluctuations of the body potential may be significantly reduced, thereby improving the overall performance of advanced SOI devices. In particular embodiments, the mechanism may be selectively applied to threshold voltage sensitive device areas, such as static RAM areas.
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PCT Search Report Dated Sep. 4, 2007 for serial No. PCT/US07/007559.
Translated German office action dated March 14, 2007.
Bloomquist Joe
Hoentschel Jan
Horstmann Manfred
Wei Andy
Advanced Micro Devices , Inc.
Menz Laura M
Williams Morgan & Amerson P.C.
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