SOI substrate and manufacturing method thereof

Details SOI substrate and manufacturing method thereof SOI substrate and manufacturing method thereof

2007-04-24

2007-04-24

Koch, George (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S297000, C156S299000

Reexamination Certificate

active

10862439

ABSTRACT:
An active layer wafer having a larger diameter is placed over a stationary supporting substrate wafer having a smaller diameter. A pusher plate is pressed against an orientation flat of the larger wafer to move the wafer substantially in the horizontal direction. In the course of the pressing operation, the pusher plate is also pressed against the orientation flat of the smaller wafer so as to move the two wafers together. Then, as a result of each of the cut sections for alignment of the wafer being pressed against an aligning plate, the larger wafer and the smaller wafer can be bonded to each other with their centerlines and orientation flats aligned with respect to each other.

REFERENCES:
patent: 5869386 (1999-02-01), Hamajima et al.
patent: 2002/0040754 (2002-04-01), Tomita et al.
patent: 2535957 (1996-07-01), None
patent: 9-213593 (1997-08-01), None
patent: 2000-223683 (2000-08-01), None

Affiliated with

Also associated with

Rating

SOI substrate and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with SOI substrate and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and SOI substrate and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3804347