SOI MOSFET

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S348000, C257S349000

Reexamination Certificate

active

06933569

ABSTRACT:
A semiconductor device includes a semiconductor layer formed on an insulator, a gate insulating film formed on the semiconductor layer, a gate electrode formed on the gate insulating film and extending in a first direction, source/drain regions formed in the semiconductor layer on both sides of the gate electrode, a body contact region in the semiconductor layer, a partial isolating region in which a field insulating film thicker than the gate insulating film intervenes between the semiconductor layer and an extending portion of the gate electrode, and a full isolating region in which the semiconductor layer on the insulator is removed. The full isolating region is formed to be in contact with at least a part of a side parallel to the first direction of the source/drain regions.

REFERENCES:
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Koh et al., “Body-Contacted SOI MOSFET Structure with Fully Bulk CMOS Compatible Layout and Process”,IEEE Electron Device Letters, vol. 18, No. 3, Mar. 1997, pp. 102-104.
Chen et al., “Suppression of the SOI Floating-body Effects by Linked-body Device Structure”,1996 Symposium on VLSI Technology Digest of Technical Papers, Jun. 11-13, 1996, pp. 92-93.
Maeda et al., “Impact of 0.18μm SOI CMOS Technology using Hybrid Trench Isolation with High Resistivity Substrate on Embedded RF/Analog Applications”,2000 Symposium on VLSI Technology Digest of Technical Papers, Jun. 13-15, 2000, pp. 154-155.
Yamagami et al., “Thin Film SOI-MOSFET with Body Contact Structure using Elevated Field Insulator”,The Japan Society of Applied Physics, The 63rdAutumn Meeting, 2002, Sep. 24, 2002, pp. 801, with English translation.

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