SOI FET design to reduce transient bipolar current

Details SOI FET design to reduce transient bipolar current SOI FET design to reduce transient bipolar current

1996-09-12

1998-06-23

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Field effect device

Having insulated electrode

257348, 257349, H01L 2701

Patent

active

057708819

ABSTRACT:
Producing a gap between a source and/or drain region of a silicon-on-insulator (SOI) field effect transistor which is less than the thickness of a depletion region normally surrounding the source and/or drain region, preferably at zero volts bias, permits gain of a parasitic bipolar transistor formed therewith to be transiently reduced and the effective base-emitter junction capacitance to be transiently increased during only modes of operation in which the parasitic bipolar conduction dominates normal operation of the field effect transistor. Such transient reduction of gain coupled with a transient reduction of high frequency response reduces the parasitic bipolar current spike to a degree greater than previously achievable and is fully compatible with other techniques of reducing such current spike. As applied to an SOICMOS SRAM, the transistor structure including such a gap is effective in suppressing half-select write disturb effects while maintaining the benefits of excess charge storage and floating body effects in the transistor.

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