Socket for semiconductor devices

Details Socket for semiconductor devices Socket for semiconductor devices

1996-08-13

1999-03-16

Stephan, Steven L.

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

439 71, H01R 1362

Patent

active

058822216

ABSTRACT:
A socket which compensates for non-planarities in a semiconductor device. The socket has a base with an aperture for receiving a semiconductor device and a plurality of bond pads within the aperture. The bond pads are typically electrically connected to external circuitry in some fashion. The socket also includes a lid which has a spring loaded portion for applying a force on a back surface of a semiconductor device when a major surface of the lid is in intimate contact with a major surface of the base such that contacts on the semiconductor device may make electrical contact to the bond pads while compensating for non-planarities in the semiconductor device. This compensation scheme is located in the spring loaded portion of the lid. This compensation scheme may also be aided through the use of a compliant, and perhaps compressible, interposer disposed between the semiconductor device's contacts and the bond pads.

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Nolan et al., A Tab Tape-Based Bare Chip Test and Burn Carrier, 1994 ITAP and Flip Chip Proceedings, pp. 173-179.
Hill et al., Mechanical Interconnection System for Solder Bump Dice, 1994 ITAP and Flip Chip Proceedings, pp. 82-86.
Alan D. Knight, MCM to Printed Wiring Board (Second Level) Connection Technology Options, Multichip Module Technologies and Alternatives, ed. by Daryl Ann Doane and Paul D. Franzon, Van Nostrand, 1993, pp. 504-509 and pp. 521-523.

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