4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

Tan Nguyen

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Encapsulation of microelectronic assemblies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Encapsulation of microelectronic assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Flexible connectors for microelectronic elements

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Lamination machine and method to laminate a coverlay to a...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from liquid combined with subsequent diverse...
Reexamination Certificate

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Method and apparatus for detecting liquid levels in...

Measuring and testing – Liquid level or depth gauge – Immersible electrode type
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Profile ID: LFUS-PAI-P-766058

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