Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-07-11
2006-07-11
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07074050
ABSTRACT:
A socket assembly with incorporated memory structure is provided. A chip carrier socket assembly includes dual stage clamping actuation. A first clamping actuation stage provides clamping force for ball grid array (BGA) contact pads and a second clamping actuation stage provides clamping force for a thermal interface. The first clamping actuation stage provides clamping force proximate to a perimeter of a carrier where a plurality of BGA contact pads are located. The second clamping actuation stage provides clamping force generally centrally of the chip carrier socket assembly for thermal interface actuation.
REFERENCES:
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5267867 (1993-12-01), Agahdel et al.
patent: 6181567 (2001-01-01), Roemer et al.
patent: 2005/0174744 (2005-08-01), Zheng
patent: 2005/0276029 (2005-12-01), Lober
Bartley Gerald Keith
Becker Darryl John
Dahlen Paul Eric
Germann Philip Raymond
Maki Andrew Benson
International Business Machines - Corporation
Pennington Joan
Ta Tho D.
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