Smart interconnect for modular multi-component embedded devices

Details Smart interconnect for modular multi-component embedded devices Smart interconnect for modular multi-component embedded devices

2007-02-16

2009-12-22

Tsai, Henry W. H. (Department: 2184)

Electrical computers and digital data processing systems: input/

Input/output data processing

Peripheral configuration

C710S062000, C710S072000, C710S104000, C361S790000

Reexamination Certificate

active

07636796

ABSTRACT:
A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards.

REFERENCES:
patent: 4604689 (1986-08-01), Burger
patent: 4733461 (1988-03-01), Nakano
patent: 5201038 (1993-04-01), Fielder
patent: 5583749 (1996-12-01), Tredennick et al.
patent: 5698895 (1997-12-01), Pedersen et al.
patent: 5794014 (1998-08-01), Shetty et al.
patent: 6253268 (2001-06-01), Bjorkengren et al.
patent: 6326806 (2001-12-01), Fallside et al.
patent: 6510484 (2003-01-01), Kim et al.
patent: 6931468 (2005-08-01), Smith et al.
patent: 7376760 (2008-05-01), Ivchenko et al.
patent: 2002/0186245 (2002-12-01), Chandhoke et al.
patent: 2003/0020512 (2003-01-01), Mantey et al.
patent: 2003/0023793 (2003-01-01), Mantey et al.
patent: 2003/0040881 (2003-02-01), Steger et al.
patent: 2004/0098569 (2004-05-01), Smith et al.
patent: 2004/0212634 (2004-10-01), Hayhow
patent: 2005/0028127 (2005-02-01), Mauersberger
patent: 2006/0023384 (2006-02-01), Mukherjee et al.
patent: 651343 (1995-05-01), None
‘AnyBoard: An FPGA-Based Reconfigurable System’ by Van Den Bout et al., IEEE, 1992.
Bolotin, “Space-Cube: A Flexible Computer Architecture Based On Stacked Modules”, retrieved at <<http://ieeexplore.ieee.org/iel3/3598/10713/00510763.pdf?isnumber=&arnumber=510763>>, Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, pp. 20-25.
“iPack Stackable Board Format”, retrieved on Aug. 17, 2006, at <<http://www.mcc-us.com/ipack1.htm>>, Micro Computer Control Corporation, Hopewell, New Jersey, USA, pp. 1-2.
Kalinsky, et al., “Introduction to I2C”, retrieved on Aug. 17, 2006, at <<http://www.embedded.com/showArticle.jhtml?articlelD=9900244>>, Embedded Systems Design, Jul. 31, 2001, pp. 1-5.
Webb, “Board Shuffle: Chasing Technology” retrieved on Aug. 17, 2006, at <<http://www.edn.com/article/CA480470.html>>, EDN, Nov. 25, 2004, pp. 1-7.

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