Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2011-03-29
2011-03-29
Rose, Robert (Department: 3727)
Abrading
Abrading process
With tool treating or forming
C451S443000
Reexamination Certificate
active
07914363
ABSTRACT:
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.
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Karuppiah Lakshmanan
Yilmaz Alpay
Applied Materials Inc.
Patterson & Sheridan LLP
Rose Robert
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