Small chips with fan-out leads

Details Small chips with fan-out leads Small chips with fan-out leads

2006-10-26

2011-10-18

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S106000, C438S123000, C257S182000, C257S661000, C257SE33066, C257SE23014, C257SE23031

Reexamination Certificate

active

08039363

ABSTRACT:
A method of expanding the contact pitch for un-diced chips in an array by pre-slicing the array in a first direction, attaching a lead frame to the chips' contacts, and then slicing the array and attached lead frame in the second direction. The lead frame has leads mechanically connected one another such that slicing the frame in the second direction along the mechanical connections separates the leads. Each lead has a first terminal which is conductively attached to a chip contact and a second terminal extending beyond the boundaries of the chip to which the first terminal is attached. In this manner, the contact pitch is effectively expanded to the terminal pitch of the leads.

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