Slurry recycling system for chemical-mechanical polishing appara

Details Slurry recycling system for chemical-mechanical polishing appara Slurry recycling system for chemical-mechanical polishing appara

1997-04-07

1998-08-11

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 5, 451 60, 451446, B24B 5700

Patent

active

057919704

ABSTRACT:
A slurry recycling system for a chemical-mechanical polishing apparatus includes an annular-shaped wafer polishing platen which rotates about a non-rotating center core. A slurry dispensing system housed in the center core directs a slurry mist radially into the path of a moving wafer. The recycling system is positioned at the periphery of the platen and is controlled by an end point monitoring and control system which uniquely provides instantaneous wafer removal rate data to regulate a slurry recycling valve.

REFERENCES:
patent: 3028711 (1962-04-01), Campbell et al.
patent: 3162986 (1964-12-01), Olivieri
patent: 3500591 (1970-03-01), Gawronski et al.
patent: 4059929 (1977-11-01), Bishop
patent: 5658185 (1997-08-01), Morgan, III et al.
patent: 5664990 (1997-09-01), Adams et al.

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