Slurry injection technique for chemical-mechanical polishing

Details Slurry injection technique for chemical-mechanical polishing Slurry injection technique for chemical-mechanical polishing

1997-07-22

1999-12-07

Scherbel, David A.

Abrading

Accessory

Abradant supplying

451287, B24B 5700

Patent

active

059973927

ABSTRACT:
An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry distributor device disposed to provide a spray of the slurry on the polishing pad. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred spraying means is a closed elongated tube having a plurality of openings which tube is positioned over at least one-half the diameter of the polishing pad and a polishing slurry under pressure is directed onto the surface of the pad, preferably in a substantially transverse spray stream.

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