Abrading – Abrading process – Utilizing fluent abradant
Reexamination Certificate
2007-01-23
2007-01-23
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
Utilizing fluent abradant
C451S056000, C451S060000, C156S345120
Reexamination Certificate
active
10865818
ABSTRACT:
There is disclosed a polishing method comprising contacting a polishing surface of a semiconductor substrate with a polishing pad comprising a resin as a main component and attached to a turntable, and dropping a CMP slurry onto the polishing pad to polish the polishing surface, the CMP slurry comprising a resin particle, an inorganic particle, a polymerizable component, and a polymerization initiator.
REFERENCES:
patent: 4243784 (1981-01-01), Akima et al.
patent: 5876490 (1999-03-01), Ronay
patent: 6074287 (2000-06-01), Miyaji et al.
patent: 6362107 (2002-03-01), Shiro et al.
patent: 6375545 (2002-04-01), Yano et al.
patent: 6454819 (2002-09-01), Yano et al.
patent: 6488570 (2002-12-01), James et al.
patent: 6576554 (2003-06-01), Matsui et al.
patent: 6582761 (2003-06-01), Nishimoto et al.
patent: 6740590 (2004-05-01), Yano et al.
patent: 2001/0016470 (2001-08-01), Nobe
patent: 2001/0036798 (2001-11-01), Oliver
patent: 11-176774 (1999-07-01), None
Alger, Mark, Polymer Science Dictionary, 1997, Published by Chapman & Hall, Second Edition, p. 427.
Matsui Yukiteru
Minamihaba Gaku
Yano Hiroyuki
Hail III Joseph J.
Kabushiki Kaisha Toshiba
Muller Bryan R.
LandOfFree
Slurry for CMP, polishing method and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Slurry for CMP, polishing method and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slurry for CMP, polishing method and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3807974