Slurry for CMP and CMP method

Details Slurry for CMP and CMP method Slurry for CMP and CMP method

2008-04-29

2008-04-29

Ahmed, Shamim (Department: 1792)

Compositions

Etching or brightening compositions

C106S003000, C510S221000, C510S245000, C051S309000, C216S088000, C216S089000, C216S100000

Reexamination Certificate

active

10155015

ABSTRACT:
A CMP slurry comprising polishing abrasives containing mixture abrasives of silica and alumina is used. In CMP using the slurry comprising mixture abrasives of silica and alumina as polishing abrasives, a down force-dependency of a polishing rate is high and an increase in dishing can be effectively suppressed.

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