Slurry for chemical mechanical polishing for copper and...

Details Slurry for chemical mechanical polishing for copper and... Slurry for chemical mechanical polishing for copper and...

2006-11-21

2006-11-21

Worton, Nadine (Department: 1765)

Compositions

Etching or brightening compositions

C438S692000, C451S041000, C051S308000, C510S175000

Reexamination Certificate

active

07138073

ABSTRACT:
A method of manufacturing a semiconductor device using a polishing slurry for CMP of Cu, which includes a first complexing agent containing a heterocyclic compound which is capable of forming a water-insoluble complex with Cu, and a second complexing agent containing a heterocyclic compound which is capable of forming a slightly water-soluble or water-soluble complex with Cu to thereby provide at least one extra ligand subsequent to formation of the complex.

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patent: 2001-110759 (2001-04-01), None
patent: 2001-189296 (2001-07-01), None
patent: 2001-269860 (2001-10-01), None

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