Slurry flow rate monitoring in chemical-mechanical polisher...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C137S012000, C451S008000, C451S060000, C451S099000, C451S446000

Reexamination Certificate

active

06855031

ABSTRACT:
In a first aspect of the invention, a polishing device is provided. The polishing device includes a platen adapted to support a polishing pad and also includes a source of polishing slurry. Also included in the polishing device is a slurry supply line adapted to supply the polishing slurry from the source of polishing slurry to the polishing pad. The polishing device includes a pressure transducer installed along the slurry supply line and adapted to detect a pressure inside the slurry supply line. Numerous other aspects are provided.

REFERENCES:
patent: 4492248 (1985-01-01), Aude
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5693887 (1997-12-01), Englund et al.
patent: 5852244 (1998-12-01), Englund et al.
patent: 5857893 (1999-01-01), Olsen et al.
patent: 6149508 (2000-11-01), Vanell et al.
patent: 6183341 (2001-02-01), Melcer

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