Slurry distributor for chemical mechanical polishing...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S056000, C451S060000, C451S287000, C451S444000

Reexamination Certificate

active

06887132

ABSTRACT:
A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield. Optionally, the apparatus (100) further includes a dispenser (186) for dispensing a cleaning fluid before and/or after the wiper (180) to substantially eliminate buildup of deposits.

REFERENCES:
patent: 5645682 (1997-07-01), Skrovan
patent: 5709593 (1998-01-01), Guthrie et al.
patent: 5997392 (1999-12-01), Chamberlin et al.
patent: 6051499 (2000-04-01), Tolles et al.
patent: 6280297 (2001-08-01), Tolles et al.
patent: 6280299 (2001-08-01), Kennedy et al.
patent: 6283840 (2001-09-01), Huey
patent: 6284092 (2001-09-01), Manfredi
patent: 6336850 (2002-01-01), Wada et al.
patent: 6429131 (2002-08-01), Lin et al.
patent: 6468134 (2002-10-01), Gotkis

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