Slurry distribution system for a CMP process in semiconductor de

Details Slurry distribution system for a CMP process in semiconductor de Slurry distribution system for a CMP process in semiconductor de

1998-04-20

2000-02-08

Chambers, A. Michael

Fluid handling

Liquid level responsive or maintaining systems

With control fluid connection at desired liquid level

137395, 137592, F03B 1100

Patent

active

060218061

ABSTRACT:
A slurry distribution system for supplying slurry used in the planarization process of a wafer surface by chemical reaction is provided with a movable supply line having an open end which is maintained at a constant depth below the surface of the slurry in the slurry tank. The movable supply line penetrates the top of the tank and is supported for vertical movement in an opening in the top of the tank. The other end of the movable supply line is located outside the tank and is connected to a main supply line which leads to CMP equipment. A pleated flexible tubing allows the movable supply line to move vertically relative to the main supply line and the top of the tank. A position-controlling mechanism keeps the open end of the movable supply line at a predetermined distance below the top surface of the slurry in the tank as the top surface rises and falls, by moving the movable supply line vertically in accordance with the changing amount of slurry inside the tank. Keeping the open end of the movable supply line at a predetermined depth below the top surface of the slurry prevents distorted and lumped slurry residue which may be present at the bottom of the tank from entering the movable supply line.

REFERENCES:
patent: 2613922 (1952-10-01), Gatchet
patent: 2624070 (1953-01-01), McDermott
patent: 3060954 (1962-10-01), Froetschner

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