Slurry dispensing system for chemical-mechanical polishing appar

Details Slurry dispensing system for chemical-mechanical polishing appar Slurry dispensing system for chemical-mechanical polishing appar

1997-04-18

1998-12-01

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 88, 438692, B44C 122

Patent

active

058432698

ABSTRACT:
Chemical-mechanical polishing apparatus includes three subassemblies, a top subassembly which is non-rotating but which has a lower section which forms a shell about a center and a lower subassembly both of which rotate within the shell. The system also includes a slurry dispensing system which is embedded in the shell and which is operative to supply slurry just in front of the advancing edge of a wafer being polished by the system. The slurry dispensing system includes a tube with holes arranged 180 degrees about the shell of the non-rotating subassembly which is also operative to retain the wafer in contact with the (rotating) pad covered platen with which it is in contact.

REFERENCES:
patent: 4600469 (1986-07-01), Fusco et al.
patent: 5593537 (1997-01-01), Cote et al.

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