Slurry delivery system, chemical mechanical polishing...

Details Slurry delivery system, chemical mechanical polishing... Slurry delivery system, chemical mechanical polishing...

2008-03-04

2008-03-04

Ackun, Jr., Jacob K. (Department: 3728)

Abrading

Abrading process

Abradant supplying

C451S446000

Reexamination Certificate

active

07338352

ABSTRACT:
A slurry delivery system, a chemical mechanical polishing (CMP) apparatus, and method for using the same are provided. An apparatus for supplying slurry to a polishing unit may include a first feed line through which an abrasive may be supplied at a first velocity. A velocity-changing member may be connected to the first feed line, and/or a velocity of the abrasive may be changed from the first velocity to. the second velocity different from the first velocity by the velocity-changing member. A second feed line may be connected to the velocity-changing member and/or an additive may be supplied through the second feed line. A supply line may be connected to the velocity-changing member. A slurry, which may be a mixture of the abrasive and/or the additive, may be supplied to a polishing unit through the supply line. Accordingly, the slurry may be more uniformly mixed and/or supplied to a polishing unit.

REFERENCES:
patent: 6053803 (2000-04-01), Pizzimenti et al.
patent: 6168503 (2001-01-01), Pao et al.
patent: 2002/0061722 (2002-05-01), Kondo et al.
patent: 2000-277468 (2000-10-01), None
patent: 1020040004794 (2004-01-01), None
patent: 1020040040965 (2004-05-01), None

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