Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Patent
1998-03-12
1999-10-26
Kopec, Mark
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
510181, 510186, 510202, 510236, 510241, 510242, 510245, 510252, 510254, 510268, 510272, 510460, 134 12, C11D 314, C11D 706, C11D 920
Patent
active
059728639
ABSTRACT:
Compositions useful for polishing wafers to be used in microelectronic devices comprise silicon dioxide, aluminum oxide, sodium hydroxide, and water. Cleaning compositions for removing electron wax from wafers to be used in microelectronic devices comprise from about 2 to about 6 percent by weight of ammonium hydroxide, from about 10 to about 22 percent by weight of hydrogen peroxide, and water.
REFERENCES:
patent: 4057939 (1977-11-01), Basi
patent: 4284533 (1981-08-01), Imamura et al.
patent: 4491478 (1985-01-01), Williamson
patent: 4710232 (1987-12-01), Tahbaz
patent: 4840746 (1989-06-01), Shiozaki et al.
patent: 4954459 (1990-09-01), Avanzino et al.
patent: 5032203 (1991-07-01), Doy et al.
patent: 5670011 (1997-09-01), Togawa et al.
Cho Sung-hoon
Heo Tae-yeol
Kim Gi-jung
Park Jung-min
Boyer Charles
Kopec Mark
Samsung Electronics Co,. Ltd.
LandOfFree
Slurry compositions for polishing wafers used in integrated circ does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Slurry compositions for polishing wafers used in integrated circ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slurry compositions for polishing wafers used in integrated circ will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-764334