Slope etching process

Details Slope etching process Slope etching process

1993-09-24

1995-04-25

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 1566591, 156643, 156646, B05D 500

Patent

active

054095662

ABSTRACT:
A slope etching process including dipping a pattern forming layer into a predetermined dipping solution containing an etching solution or wet etching and deionized water, so as to utilize a wet etching method only for isotropic etching. There is also provided a slope etching process including forming a photoresist pattern layer having inclined edges and etching the photoresist pattern layer together with the pattern forming layer by using a gas mixture containing an etching gas for dry etching and O.sub.2 gas, so as to utilize a RIE method only for anisotropic etching. According to the processes, it is possible to slope etch the pattern forming layer so as to form a pattern layer having a desired edge slope. Furthermore, the step coverage after process integration and productivity can be improved.

REFERENCES:
patent: 3833434 (1974-09-01), Kikuchi et al.
patent: 4075367 (1978-02-01), Grulett
patent: 4698128 (1987-10-01), Berglund et al.
patent: 4698132 (1987-10-01), Dennis
patent: 4814041 (1989-03-01), Anda
patent: 4935334 (1990-06-01), Boettiger et al.
patent: 4956035 (1990-09-01), Sedlak
patent: 5057186 (1991-10-01), Chew et al.

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