Slope etch of polyimide

Details Slope etch of polyimide Slope etch of polyimide

1984-03-30

1984-12-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156646, 156651, 156653, 156647, 1566591, 156668, 204192E, B44C 122, C03C 1500, C03C 2506

Patent

active

044876521

ABSTRACT:
A sloped via through polyimide between metal layers is achieved by first sloping a hard mask which overlies the polyimide. Sloped photoresist overlying the hard mask transfers the slope to the hard mask. The sloped hard mask is used to slope the polyimide. Oxide underlying the polyimide is also etched to expose the metal. The underlying oxide layer can be subsequently slope etched.

REFERENCES:
patent: 4140572 (1979-02-01), Stein
patent: 4218283 (1980-08-01), Saiki et al.
patent: 4411735 (1983-10-01), Belani
patent: 4417947 (1983-11-01), Pan

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