Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-08-01
2006-08-01
Hyeon, Hae Moon (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S091000, C438S667000
Reexamination Certificate
active
07083425
ABSTRACT:
Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.
REFERENCES:
patent: 4534100 (1985-08-01), Lane
patent: 5771158 (1998-06-01), Yamagishi et al.
patent: 6774486 (2004-08-01), Kinsman
patent: 6797616 (2004-09-01), Kinsman
patent: 2001077496 (2001-03-01), None
Search Report and Examination Report for Singapore Application No. 200405514-1, 7 pages, Jul. 22, 2005.
Chong Chin Hui
Lee Choon Kuan
Micro)n Technology, Inc.
Perkins Coie LLP
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