Abrading – Precision device or process - or with condition responsive... – With feeding of tool or work holder
Reexamination Certificate
2007-07-10
2007-07-10
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With feeding of tool or work holder
C451S067000, C451S283000, C451S339000
Reexamination Certificate
active
11608588
ABSTRACT:
The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base, a first wash station disposed on the base adjacent to the first of the four polishing station, and a carousel rotatable about a carousel axis and supported by the base, wherein the carousel comprises six substrate heads alignable to any of the four polishing stations, the two load cups and the first wash station.
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Chen Hung Chih
Yavelberg Simon
Ackun Jr. Jacob K.
Applied Materials Inc.
Patterson & Sheridan
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