Single workpiece processing system

Details Single workpiece processing system Single workpiece processing system

2005-05-31

2005-05-31

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S758000, C438S780000, C438S782000, C438S913000, C134S153000, C134S157000, C118S72300R

Reexamination Certificate

active

06900132

ABSTRACT:
A system for processing semiconductor wafers has process units on a deck of a frame. The process units and the deck have precision locating features, such as tapered pins, for precisely positioning the process units on the deck. Process units can be removed and replacement process units installed on the deck, without the need for recalibrating the load/unload robot. This reduces the time needed to replace process units and restart processing operations. Liquid chemical consumption during processing is reduced by drawing unused liquid out of supply lines and pumping it back to storage.

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