Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-08-28
1992-07-28
Kunemund, Robert
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566207, 15662071, 15662072, 156DIG64, 156DIG98, 156DIG102, 422247, 422251, 422253, C30B 3000
Patent
active
051338297
ABSTRACT:
A wafer chuck is used to support a circular silicon wafer, which has formed from a single wafer casting process, in order to perform monocrystalline silicon regrowth. The cast wafer, having a monocrystalline silicon seed, located at its center, rests atop raised portions of the chuck and is held in place by vacuum at the center and the perimeter. The rest of the underside of the wafer is physically separated from the chuck surface by pressurized gas. An annular laser beam is then used to melt the silicon from the seed outward to grow the wafer into a monocrystalline form.
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Zone Melting; William G. Pfann; John Wiley and Sons: New York; 1958 and 1966.
Garrett Felisa
Kidd William W.
Kunemund Robert
Sematech Inc.
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