Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-08-02
2005-08-02
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S778000, C438S478000
Reexamination Certificate
active
06924231
ABSTRACT:
Process operations are performed for subjecting target substrates respectively to a semiconductor process, while a target substrate is placed on a worktable within a process chamber, and the worktable is heated by a temperature control member to heat the target substrate. The reflection coefficient within the process chamber is changed depending on deposition of a by-product, which is generated during the semiconductor process on the target substrate, within the process chamber. A parameter representing the reflection coefficient within the process chamber is measured, between the first and last ones of the process operations. The set temperature of the worktable used in the semiconductor process is adjusted, based on measured value of the parameter, during process operations performed after measuring the parameter. As a consequence, repeatability of the semiconductor process is improved.
REFERENCES:
patent: 5271084 (1993-12-01), Vandenabeele et al.
patent: 6171641 (2001-01-01), Okamoto et al.
patent: 6573185 (2003-06-01), Kariya
patent: 831519 (1998-03-01), None
patent: 1-124726 (1989-05-01), None
patent: 4-48724 (1992-02-01), None
patent: 4-206524 (1992-07-01), None
patent: 5-217930 (1993-08-01), None
Kobayashi Hirokatsu
Sakuma Takeshi
No associations
LandOfFree
Single wafer processing method and system for processing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Single wafer processing method and system for processing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single wafer processing method and system for processing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3510478