Material or article handling – Apparatus for moving material between zones having different...
Reexamination Certificate
2005-10-18
2005-10-18
Basichas, Alfred (Department: 3749)
Material or article handling
Apparatus for moving material between zones having different...
C414S939000
Reexamination Certificate
active
06955516
ABSTRACT:
In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
REFERENCES:
patent: 4534314 (1985-08-01), Ackley
patent: 4548699 (1985-10-01), Hutchinson et al.
patent: 4647266 (1987-03-01), Coad et al.
patent: 5154730 (1992-10-01), Hodos et al.
patent: 5215420 (1993-06-01), Hughes et al.
patent: 5425611 (1995-06-01), Hughes et al.
patent: 5616063 (1997-04-01), Okumura et al.
patent: 6068441 (2000-05-01), Raaijmakers et al.
patent: 6083566 (2000-07-01), Whitesell
patent: 6095741 (2000-08-01), Kroeker et al.
patent: 6273802 (2001-08-01), Okumura et al.
patent: 6425806 (2002-07-01), Okumura et al.
patent: 6439971 (2002-08-01), Okumura et al.
patent: 6443808 (2002-09-01), Okumura et al.
patent: 6547638 (2003-04-01), Okumura et al.
patent: 0 833 375 (1998-04-01), None
patent: WO 00/28578 (2000-05-01), None
U.S. Appl. No. 2001/0004898A1, dated Jun. 28, 2001.
U.S. Appl. No. 2001/0004899A1, dated Jun. 28, 2001.
U.S. Appl. No. 2001/0010997A1, dated Aug. 2, 2001.
Achkire Younes
Fang Haoquan
Fishkin Boris
Govzman Boris T.
Lerner Alexander
Applied Materials Inc.
Basichas Alfred
Dugan & Dugan
LandOfFree
Single wafer dryer and drying methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Single wafer dryer and drying methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single wafer dryer and drying methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3468440