Cleaning and liquid contact with solids – Apparatus – Sequential work treating receptacles or stations with means...
Reexamination Certificate
2011-07-19
2011-07-19
Barr, Michael (Department: 1711)
Cleaning and liquid contact with solids
Apparatus
Sequential work treating receptacles or stations with means...
C414S217000, C414S939000
Reexamination Certificate
active
07980255
ABSTRACT:
In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
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Jul. 1, 2008 R
Achkire Younes
Fang Haoquan
Fishkin Boris
Govzman Boris T.
Lerner Alexander
Applied Materials Inc.
Barr Michael
Dugan & Dugan PC
Riggleman Jason P
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